Across the great divide: Examination of simulation data with actual silicon waveforms improves device characterization and production test development

IEEE International Test Conference (TC)

Volumn , Issue , 2002, Pages 270-274

  Austin, Tom ^a   Canlas, Charisma ^a   Morgan, Brady ^a   Rodriguez, Jorge Luis ^a  

^a TERADYNE INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; DESIGN FOR TESTABILITY; PRODUCT DESIGN; PRODUCT DEVELOPMENT; WAVEFORM ANALYSIS;

DEVICE CHARACTERIZATION; PRODUCTION TEST DEVELOPMENT; SILICON WAVEFORMS;

INTEGRATED CIRCUIT TESTING;

EID: 0036445984     PISSN: 10893539     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEST.2002.1041769     Document Type: Article

References (4)

1. Force, Craig, "Emerging Test Simulation Tools: Design and Test Integration," Teradyne Users Group, 1998
2. Silicon Signals Patent Application #blah.
3. Rosenfeld, E., "Issues for Mixed-Signal CAD-Tester Interface," IEEE International Test Conference, pp. 585-590, 1989.
4. Austin, Tom, Khouzam, Nash, Xia, Jean Q., "Faster Mixed-Signal Development Using CAD to Model IC, Package, and Test Systems," The First International Conference on Electronics, Circuits & Systems, pp. 216-222, 1994.