Development of all solid compact connection system for high voltage equipment-Effect of thin air layer on breakdown strength of solid-Solid interface

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report

Volumn , Issue , 2002, Pages 486-489

  Takahashi, Toshihiro ^a   Takahashi, Tsuguhiro ^a   Takeda, Toshinao ^a   Okamoto, Tatsuki ^a  

^a Central Research Institute of EPI   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN; ELECTRIC INSULATING MATERIALS; ELECTRIC POTENTIAL; INTERFACES (MATERIALS); TRANSFORMER WINDINGS;

HIGH VOLTAGE EQUIPMENTS;

ELECTRIC EQUIPMENT;

EID: 0036443812     PISSN: 00849162     EISSN: None     Source Type: Journal    
DOI: 10.1109/CEIDP.2002.1048840     Document Type: Article

References (4)

1. L.G. Christophorou and R.J. Van Brunt, "SF6/N2 Mixtures-Basic and HV Insulation Properties", IEEE Trans. on DEI, Vol. 2, No. 5, pp. 952-1003, 1995.
2. H. Tsuchida, et al., "Growth and Electrical Characterization of Lightly-Doped Thick 4H-SiC Epilayers", Materials Science Forum, Vols. 389-393, pp. 171-174, 2002.
3. D.D. Arnone, et al., "Applications of Terahertz (THz) Technology to Medical Imaging", Proc. SPIE, Vol. 3828, pp. 209-219, 1999.
4. P. Moon and D.E. Spencer, Field Theory for Engineers, pp. 202-210, D.van Hostrand Co., Inc., 1961.