The optimal design of structure parameters for microchannel heatsink

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4914, Issue , 2002, Pages 181-186

  Liao, X S ^a   Liu, Y ^a   Ning, Y Q ^a   Cheng, D M ^a   Wang, L ^a   Wang, L J ^a  

^a CHANGCHUN INSTITUTE OF OPTICS   (China)

Author keywords

Channels; Fins; Micro channel heat sink; Thermal characteristic

Indexed keywords

COMPUTER SIMULATION; COPPER; HEAT CONVECTION; HEAT EXCHANGERS; HEAT RESISTANCE; HIGH POWER LASERS; PRESSURE DROP; SEMICONDUCTOR LASERS; THERMAL CONDUCTIVITY;

COOLING LIQUID PRESSURE DROP; MICROCHANNEL HEATSINK; THERMAL CHARACTERISTICS;

FINS (HEAT EXCHANGE);

EID: 0036441761     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.481814     Document Type: Conference Paper

References (5)

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4. Thomas Ebert, "Optimization of microchannel heatsinks for high power diode lasers in copper technology",SPIE vol.3285,pp.24-29,1998.
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