Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation

TMS Annual Meeting

Volumn , Issue , 2002, Pages 419-428

  Kozlov, E V ^a   Zhdanov, A N ^a   Ignatenko, L N ^a   Popova, N A ^a   Ivanov, Yu F ^a   Koneva, N A ^a  

^a TOMSK STATE UNIVERSITY OF ARCHITECTURE AND BUILDING   (Russian Federation)

Author keywords

Copper; Deformation; Structure; Ultrafine grain

Indexed keywords

DISLOCATIONS (CRYSTALS); ELECTRON MICROSCOPY; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; PLASTIC DEFORMATION; RESIDUAL STRESSES; STRAIN HARDENING; STRAIN RATE; STRUCTURE (COMPOSITION);

IN GRAIN DISLOCATION SLIP; SCALAR DISLOCATION DENSITY; STRAIN RESISTANCE; TRANSMISSION DIFFRACTION ELECTRON MICROSCOPY; ULTRAFINE GRAIN;

COPPER ALLOYS;

EID: 0036441115     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1002/9781118804537.ch48     Document Type: Conference Paper

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