Chemical reactions and morphological stability at the Cu/Al2O3 interface

Journal of Microscopy

Volumn 208, Issue 1, 2002, Pages 11-17

  Scheu, C ^a   Klein, S ^a   Tomsia, A P ^b   Ruhle M ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

Cu Al2O3; Diffusion bonding; Interfaces; Reaction phases; TEM

Indexed keywords

ADHESION; ALUMINA; ANNEALING; CHEMICAL BONDS; CHEMICAL STABILITY; COPPER COMPOUNDS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; NEEDLES; OXYGEN;

CU/AL2O3; HIGH OXYGEN PARTIAL PRESSURE; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MICROSCOPY TECHNIQUE; MORPHOLOGICAL STABILITY; OXYGEN PARTIAL PRESSURE; REACTION PHASIS; REACTION STABILITY; RHOMBOHEDRAL STRUCTURES; TEM;

ALUMINUM OXIDE;

ALLOY; ALUMINUM OXIDE; CHEMICAL COMPOUND; COPPER; COPPER ALUMINUM OXIDE; UNCLASSIFIED DRUG;

ARTICLE; CHEMICAL ANALYSIS; CHEMICAL BOND; CHEMICAL REACTION; CHEMICAL STRUCTURE; CRYSTALLIZATION; MICROSCOPY; OXYGEN TENSION; PRIORITY JOURNAL; TRANSMISSION ELECTRON MICROSCOPY;

EID: 0036436892     PISSN: 00222720     EISSN: None     Source Type: Journal    
DOI: 10.1046/j.1365-2818.2002.01065.x     Document Type: Article

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