Effect of the substrate thermal expansion coefficient on the thermal residual stresses in W-Si-N sputtered films

Key Engineering Materials

Volumn 230-232, Issue , 2002, Pages 513-516

  Louro, C ^a   Teixeira Dias, F ^a   Menezes, L F ^a   Cavaleiro, A ^a  

^a UNIVERSITY OF COIMBRA   (Portugal)

Author keywords

Hardness; Modeling; Residual Stresses; Sputtering

Indexed keywords

COATINGS; COMPUTER SIMULATION; COOLING; FINITE ELEMENT METHOD; HARDNESS; RESIDUAL STRESSES; SPUTTER DEPOSITION; THERMAL EFFECTS; THERMAL EXPANSION; TUNGSTEN COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

LATTICE DISTORTION;

METALLIC FILMS;

EID: 0036436547     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

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