Toughening of reaction-bonded silicon nitride ceramics through microstructural design

Key Engineering Materials

Volumn 224-226, Issue , 2002, Pages 309-312

  Appiagyei, K Amoako ^a  

^a KWAME NKRUMAH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Ghana)

Author keywords

Fracture toughness; Microstructure; Reaction bonded silicon nitride; Si3N4 Seed

Indexed keywords

BENDING STRENGTH; CHEMICAL BONDS; EPITAXIAL GROWTH; FRACTURE TOUGHNESS; MICROSTRUCTURE; MORPHOLOGY; SILICON NITRIDE; SINTERING;

SINTERING FURNACES;

CERAMIC MATERIALS;

EID: 0036431888     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (7)

1. T. Kawashima, H. Okamoto, H. Yamamoto and A. Kitamura: J. Ceram. Soc. Jpn. Vol. 99 (1991), pp. 320.
2. P.F. Becher, H.T. Lin, S.L. Hwang, M.J. Hoffman and I.W. Chen: in Silicon Nitride Ceramics. Edited by I.W. Chen, et al. (Materials Research Society, Pittsburgh, PA 1993).
3. th International Symposium on Ceramic Materials and Components for Engines. (Elsevier Applied Science Publishers, Essex, England, 1992), pp. 584.
4. st International Symposium on the Science of Engineering Ceramics. (Ceramic Soc. Jpn. 1991), pp.101.
5. G. Wotting, H. Feuer and E. Gugel: in Silicon Nitride Ceramics. Edited by I.W. Chen, et al. (Materials Research Society, Pittsburgh, PA 1993).
6. M. Mitomo: in Proceedings of MRS International Meeting on Advanced Materials. (Materials Research Society, Pittsburgh).
7. th International Symposium on Ceramic Materials and Components for Engines. (Elsevier Applied Science Publishers, Essex, England, 1992), pp. 594.