New VLSI multilevel metallization technology using polyimide insulation

Mikroelektronika

Volumn 31, Issue 3, 2002, Pages 201-211

  Senk'ko, S F ^a   Snitovskij, Yu P ^a  

^a NONE

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EID: 0036427075     PISSN: 05441269     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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