New liquid crystal polymer (LCP) flex circuits to meet demanding reliability and end-use applications requirements

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4828, Issue , 2002, Pages 116-122

  Hayden, Terry F ^a  

^a 3M COMPANY   (United States)

Author keywords

Assembly; High Frequency; LCP; Liquid Crystal Polymer; Moisture Resistance; Reliability; Soldermask

Indexed keywords

ASSEMBLY; DIELECTRIC MATERIALS; ETCHING; LIQUID CRYSTAL POLYMERS; METALLIZING; RELIABILITY; THERMOPLASTICS;

FLEXIBLE CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0036421377     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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