Gallium phase formation in Cu and other FCC metals during near-normal incidence Ga-FIB milling and techniques to avoid this phenomenon

Microscopy and Microanalysis

Volumn 8, Issue SUPPL. 2, 2002, Pages 52-53

  Phaneuf, Michael W ^a   Li, J ^a   Casey, J D ^b  

^a Fibics Incorporated   (Canada)

^b Thermo Fisher Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0036413514     PISSN: 14319276     EISSN: None     Source Type: Journal    
DOI: 10.1017/s1431927602101589     Document Type: Conference Paper

References (5)

1. S. Herschbein, L.S. Fisher, T.L. Kane, M.P. Tenney, A.D. Shore, Proc. ISTFA, 127, (1998).
2. J.D. Casey, K.E. Noll, R. Shuman, C. Chandler, M. Megordan, M. Phaneuf and J. Li, LSI Testing Symposium 2000, Osaka, Japan (2000).
3. M.W. Phaneuf, J. Li, R.F. Shuman, K. Noll, J.D. Casey Jr., U.S. Patent Application 20010053605 (March 2000).
4. R.F. Shuman, K. Noll, J.D. Casey Jr., U.S. Patent 6,322,672 B1 (Issued November 2001).
5. The authors wish to thank Dr. Shigeo Saimoto of Queen's University at Kingston, Ontario, for providing the single crystal copper specimens (Dr. Saimoto is supported by Materials and Manufacturing Ontario) and also Dr. Graham Carpenter, Emeritus TEM Scientist, Materials Technology Laboratory (MTL), Natural Resources Canada and Dr. Gianluigi Botton formerly of MTL and now at McMaster University, for many useful discussions and TEM analyses over the years.