Integration using KrF and ArF resist materials in a full via first dual damascene process scheme with CVD OSG low-k dielectric

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4691 II, Issue , 2002, Pages 822-830

  Jessen, Scott W ^a   Steiner, Kurt G ^a   Wolf, Thomas M ^a   Josephson, William D ^a   Lytle, Steve A ^a   Sato, Mitsuru ^b   Lee, Chung Y ^c   Fan, Ming H ^c  

^a AGERE SYSTEMS   (United States)

^b OHKA America Inc   (United States)

^c 60 Woodlands Industrial Park   (Singapore)

Author keywords

ArF resist; Dual damascene; KrF resist; Low k dielectric

Indexed keywords

ANTIREFLECTION COATINGS; ARGON; DIELECTRIC MATERIALS; KRYPTON;

RESIST MATERIALS;

PHOTORESISTS;

EID: 0036411395     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.474632     Document Type: Article

References (3)

1. S. Lytle, I. Oladeji, T. Lee, A. Zhang, K. Steiner, S. Merchant, M. Oh, S. Jessen, G. Gibson, D. Ramappa, J. Taylor, T. Tse, M. Hariharaputhiran, G. Hua, H. Kim, L. Mattern, N. Kamat, P. Chew, D. Chesire, S. Kang, S. Vitkavage, R. Adebanjo, T. Wolf, T. Kook, R. Huang, A. Cuthbertson, S. Hillenius, and D. Ibbotson, "Overcoming Cu/CVD Low-k Integration Challenges in a High Performance Interconnect Technology," IEDM Technical Digest, pp. 611-614, Washington, D.C., 2001.
2. H.T. Schacht, N. Muenzel, P. Falcigno, H. Holzwarth, and J. Schneider, "Acid Labile Units: A New Concept For Deep-UV Photoresists," J. Photopolym. Sci. Technol. 9, pp. 573-586, 1996.
3. H.T. Schacht, P. Falcigno, N. Muenzel, N. Muenzel, R. Schulz, T. Sarubbi, and A. Medina, "New Polymers with Acid Labile Crosslinked Units and Their Performance in Deep-UV Photoresists," J. Photopolym. Sci. Technol. 10, pp. 571-578, 1997.