|
Volumn 4637, Issue , 2002, Pages 479-486
|
Water-jet guided laser: Possibilities and potential for singulation of electronic packages
a a a a
a
Synova SA
(Switzerland)
|
Author keywords
532 nm; Copper; CSP; Electronic packages; Laser cutting; MLF; Mold compound; QFN
|
Indexed keywords
ELECTRONICS PACKAGING;
INTEGRATED CIRCUIT MANUFACTURE;
JETS;
NEODYMIUM LASERS;
NOZZLES;
PHOTONS;
WATER-JET GUIDED LASERS;
LASER BEAM CUTTING;
|
EID: 0036403682
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.470656 Document Type: Conference Paper |
Times cited : (10)
|
References (3)
|