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Volumn 4637, Issue , 2002, Pages 479-486

Water-jet guided laser: Possibilities and potential for singulation of electronic packages

Author keywords

532 nm; Copper; CSP; Electronic packages; Laser cutting; MLF; Mold compound; QFN

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; JETS; NEODYMIUM LASERS; NOZZLES; PHOTONS;

EID: 0036403682     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.470656     Document Type: Conference Paper
Times cited : (10)

References (3)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.