Measurement challenges for on-wafer RF-SOC test

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 353-359

  Lau, Wai Yuen ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT TESTING; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SILICON WAFERS;

DEVICE UNDER TEST; SYSTEMS IN A PACKAGE TECHNOLOGY; SYSTEMS ON A CHIP TEST;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036398191     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)