Processing strategies for high speed 0201 implementation

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 166-172

  Houston, Paul N ^a   Bentley, Jesse ^a   Lewis, Brian J ^a   Smith, Brian A ^a   Baldwin, Daniel F ^a  

^a Advanced Assembly Technology Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; PASSIVE NETWORKS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; SCANNING ELECTRON MICROSCOPY; TECHNOLOGICAL FORECASTING;

STENCIL MANUFACTURING METHOD; TOMBSTONING;

ELECTRONICS PACKAGING;

EID: 0036396936     PISSN: 10898190     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2002.1032745     Document Type: Article

References (3)

1. Yuen, M., Benedict, K. H., Pitsch, T., Mackie, A.C., "Tombstoning of 0402 and 0201 Components: "A Study Examining the Effects of Various Process and Design Parameters on Ultra-Small Passive Devices"", from www.plexus.com.
2. Hansen, G., Kent, K., Anderson, R., Brooks, R., Guilford, Hendricks, D., Pieper, K., Butterfield, A., "0201 Component Issues: Supply Chain, Design, and Manufacturing Process", 2001 SMTA International Conference Proceedings, Chicago, IL, Sept.-Oct., 2001
3. Baldwin, D.F., Houston, P.N., Lewis, B.J., Smith, B.A., "Initial Characterization of High Yield 0201 Processing", APEX 2001 Conference Proceedings, San Diego, CA, January 2001.