Achieving a world record in ultra high speed wire bonding through novel technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 342-347

  Barp, Mario ^a   Vischer, Dieter ^a  

^a Oerlikon Assembly Equipment AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS PACKAGING; PRODUCTIVITY; STANDARDS;

INTERCONNECTING TECHNOLOGY; SUSTAINABLE ACCELERATION; WIRE BONDING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036395328     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Schwizer, Jürg et al, "MEMS System with Multiplexer for In Situ and Real-time Wire Bonding Diagnosis," SEMICON Singapore 2002, Singapore, May 2002.
2. Craig, John J., Introduction to Robotics Mechanics & Controls, Addison Wesley Publishing Company (1986).