Transmission electron microscopy for the semi-conductor industry

Micron

Volumn 33, Issue 6, 2002, Pages 515-521

  Zhang, Hong ^a  

^a NONE   (United States)

Author keywords

Sample preparation; Semi conductor; Transmission electron microscopy

Indexed keywords

ARTICLE;

EID: 0036389865     PISSN: 09684328     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0968-4328(02)00006-9     Document Type: Article

References (6)

1. Anderson, R., Walck, S.D., 1997. Specimen preparation for transmission electron microscopy of materials, IV. MRS Proceeding 480.
2. Anderson, R., Tracy, B., Bravman, J., 1991. Specimen preparation for transmission electron microscopy of materials, III. MRS Proceeding 254.
3. Benedict, J.P., Klepeis, S.J., Vandygrift, W.G., Anderson, R.M., 1989. EMSA Bulletin.
4. Bravman, J.C., Sinclair, R., 1984. Journal of Electron Microscopy Technique 1, 53-61.
5. Morris, S., et al., 1991. Proceedings of ISTFA.
6. Zhang, H., 1998. What limits the application of TEM in the semiconductor industry? Thin Solid Films 320, 77-85.