Flip chip assembly with conductive adhesives

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4217, Issue , 2002, Pages 256-260

  Gilleo, Ken ^a  

^a Assembly Materials Group   (United States)

Author keywords

Conductive adhesives; Flip chip; Lead free; Solderless; Underfill

Indexed keywords

ADHESIVES; ASSEMBLY; CONDUCTIVE MATERIALS; ELECTROMIGRATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING; STRENGTH OF MATERIALS; SURFACE MOUNT TECHNOLOGY;

CONDUCTIVE ADHESIVE; FLIP CHIP ASSEMBLY; LEAD FREE SOLDERING; SOLDERLESS ASSEMBLY; TROUBLESOME ALPHA-PARTICLE EMISSION;

FLIP CHIP DEVICES;

EID: 0036389524     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Gileo, K., "Anisotropic Conductive Adhesives", Screen Imaging Technology for Electronics, pp. 20-23, April 1988.
2. Gilleo, K. "Direct Chip Interconnect Using Polymer Bonding Technology", Electronic Connection Conference, pp. 37-44, IEEE, Houston, TX, May 1989.
3. Bolger, J. & Gilleo, K., "Area Bonding Conductive Epoxy Adhesive Preforms for Ball Grid Array and MCM Substrate Attach", IEEE Multi-Chip Module Conference Proceedings, Santa Cruz, CA, Mar (1994).
4. Gilleo, K. Polymer Thick Film, International Thomas Publishing, NY 1996.