Photoformed thick film materials and their application to fine feature circuitry

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4217, Issue , 2002, Pages 579-584

  Wang, Y L ^a   Ollivier, P J ^a   Skurski, M A ^a  

^a DUPONT COMPANY   (United States)

Author keywords

Fine features; Fodel technology; High density; Photoimageable thick film

Indexed keywords

COMPOSITION; CROSSLINKING; DIELECTRIC MATERIALS; GOLD; PHOTOCHEMICAL REACTIONS; PHOTORESISTS; PLATINUM; POLYMERIZATION; SILVER;

LOW TEMPERATURE COFIRED CERAMIC; PHOTOFORMED THICK FILM MATERIALS; PHOTOIMAGEABLE THICK FILM;

THICK FILMS;

EID: 0036386949     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. DuPont Microcircuit Materials Web Site (http://www.dupont.com/mcml).
2. J.P. Cazenave and T.R. Suess, "Fodel Photoimgeable Materials-A Thick Film Solution for High Density Multichip Modules", In Proceedings of the 1993 ISHM Conference, pp. 483-488, 1993.
3. S.A. Gallo, et.al, "Advanced Thick Film Materials for Flat Panel displays", ISHM, Europe, 1997.
4. J.H.Choi, L.P. Drozdyk, M. Tsuchiya, "A Photopatternable Tape for PDP Conductor Application", IDW'98-The Fifth International Display Workshops.
5. L.P. Drozdyk, J.H. Choi, M. Tsuchiya, "Photopatternable Conductor Tapes for PDP Applications", Society for Information Display, International Symposium, 50.3, pp. 1044-1048, May 1999.
6. M.A. Skurski, M.A. Smith, et al, "Photoimageable Silver Cofireable Conductor Compatible with 951 Green Tape", IMAPS Proceedings, pp 419-425, November, 1998.