High density pixel detector module using flip chip and thin film technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4217, Issue , 2002, Pages 553-556

  Wolf, J ^a   Gerlach, P ^a   Topper M ^a   Scherpinski, K ^a   Petter, D ^a   Kallmayer, C ^a   Basken O ^a   Grah, C ^a   Becks, K H ^a   Wermes, N ^a   Ehrmann, O ^a   Reichl, H ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

Author keywords

Flip chip; MCM; Pixel detector; Thin film technology

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; OPTICAL DEVICES; SENSORS; THIN FILM DEVICES; TRANSCEIVERS;

INNER TRACKING DETECTOR SYSTEM; LARGE HADRON COLLIDER; MODULE CONTROLLER CHIP; OPTICAL TRANSCEIVER; PIXEL DETECTOR MODULE;

MULTICHIP MODULES;

EID: 0036386934     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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6. ATLAS Pixel detector, Technical Design Report, CERN/LHCC/98-13, (5/1998).
7. O. Bäsken et al., "First MCM-Modules for a B-Physics Layer of the ATLAS Pixel Detector", Proc. of IEEE Nuclear Science Symposium, Seattle, USA (1999).