Noise coupling to on-chip integrated antennas

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2002, Pages 340-344

  Dickson, Timothy O ^a   Bravo, Daniel F ^a   Mehta, Jesal ^a   Kenneth, K O ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

Coupling; Integrated antennas; Switching noise

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC LINES; MICROPROCESSOR CHIPS; SIGNAL TO NOISE RATIO; SPURIOUS SIGNAL NOISE; SWITCHING;

INTEGRATED ANTENNAS; NOISE COUPLING;

ANTENNAS;

EID: 0036384768     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. K. Kim and K. O, "Characteristics of integrated dipole antennas on bulk, SOI, and SOS substrates for wireless communication," IEEE International Interconnect Technology Conf., pp. 21-23, June 1998.
2. Y.M.M. Antar, "Integrated antennas for wireless applications," 17th NRSC, pp. INV3/1-8, Feb 2000.
3. K. Kim, H. Yoon, and K. O, "On-chip wireless interconnection with integrated antennas," IEDM Technical Digest, pp. 485-488, Dec. 2000.
4. X. Li, T. Brogan, M. Esposito, B. Myers, and K. O, "A comparison of CMOS and SiGe LNA's and mixers for wireless LAN application," Proc. Custom Integrated Circuits Conference, pp. 531-534, May 2001.
5. D. Bravo et. al. "Estimation of the signal-to-noise ratio for on-chip wireless clock signal distribution," IEEE International Interconnect Technology Conf., pp. 9-11, June 2000.
6. J. Mehta, and K. O, "Switching Noise of Integrated Circuits (ICs) Picked up by a Planar Dipole Antenna Mounted Near the ICs," Accepted to IEEE Trans. on Electro-Magnetic Compatibility.
7. D. Bravo, "Investigation of background noise in integrated circuits relating to the design of an on-chip wireless interconnect system," Master's Thesis, University of Florida, Gainesville, 2000.
8. H.M. Greenhouse, "Design of planar rectangular microelectronic inductors," IEEE Trans. on Parts, Hybrids, and Packaging, vol. PHP-10, no. 2, June 1974, pp. 101-109.