On-chip thermal engineering for peta-scale integration

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2002, Pages 76-

  Kang, Sung Mo ^a  

^a University of California Santa Cruz   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; ELECTROMIGRATION; ENERGY UTILIZATION; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

THERMAL ENGINEERING;

VLSI CIRCUITS;

EID: 0036374230     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/505388.505407     Document Type: Conference Paper

References (0)