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Journal of Colloid and Interface Science

Volumn 248, Issue 2, 2002, Pages 389-397

Hamaker constants in integrated circuit metalization

(3) Eichenlaub, Sean a Chan, Carly a,b Beaudoin, Stephen P a

a Arizona State University (United States)

b UNIVERSITY OF MICHIGAN (United States)

Author keywords

Adhesion; Atomic force microscopy; Electronic thin films; Hamaker constants; Van der Waals forces

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; MATERIALS TESTING; MORPHOLOGY; NITROGEN; POLYTETRAFLUOROETHYLENES; SILICA; SPHERES; TITANIUM NITRIDE;

HAMAKER CONSTANTS; METALIZATION;

INTEGRATED CIRCUIT MANUFACTURE;

BIOMATERIAL; COPPER; ETHYLENE DERIVATIVE; METAL; SILICON DIOXIDE; SILVER; TITANIUM;

ARTICLE; ATOMIC FORCE MICROSCOPY; CALCULATION; EXPERIMENTAL MODEL; FORCE; GEOMETRY; INTEGRATED CIRCUIT; MATERIAL STATE; MEASUREMENT; PRIORITY JOURNAL; SURFACE PROPERTY;

EID: 0036353036 PISSN: 00219797 EISSN: None Source Type: Journal
DOI: 10.1006/jcis.2002.8241 Document Type: Article

Times cited : (76)

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