Adhesive and composite properties of a new phenylethynyl terminated imide

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 47 I, Issue , 2002, Pages 328-340

  Thompson, C M ^a   Connell, J W ^a   Hergenrother, P M ^a   Yokota, R ^a  

^a NASA LANGLEY RESEARCH CENTER   (United States)

Author keywords

Adhesives; Laminates; Phenylethynyl imides

Indexed keywords

ADHESIVES; COMPOSITE MATERIALS; CURING; GLASS TRANSITION; MOLECULAR WEIGHT; POLYIMIDES; SHEAR STRENGTH; TEMPERATURE; TENSILE STRENGTH; VISCOSITY;

COMPOSITE PROPERTIES; LOW MELT VISCOSITY; PHENYLETHYNYL TERMINATED IMIDE;

OLIGOMERS;

EID: 0036348979     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. Recent advances in polyimides 1997