Diamond turning of soft semiconductors to obtain nanometric mirror surfaces

International Journal of Advanced Manufacturing Technology

Volumn 19, Issue 9, 2002, Pages 637-641

  Fang, F Z ^a   Venkatesh, V C ^b   Zhang, G X ^a  

^a TIANJIN UNIVERSITY   (China)

^b UNIVERSITI TEKNOLOGI MALAYSIA   (Malaysia)

Author keywords

Diamond turning; Nanometric surfaces; Soft semi conductors

Indexed keywords

ATOMIC FORCE MICROSCOPY; BRITTLENESS; CUTTING; INDENTATION; INFRARED SPECTROSCOPY; NANOSTRUCTURED MATERIALS; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTIES; THERMAL EFFECTS; TURNING;

CUTTING FORCES; DIAMOND CUTTING; DIAMOND TURNING; FORCE DISTRIBUTION; KISTLER DYNAMOMETER; SOFT SEMICONDUCTORS; ULTRAPRECISION MACHINING;

SEMICONDUCTING DIAMONDS;

EID: 0036300264     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s001700200107     Document Type: Article

References (11)

1. Diamond cutting of silicon with nanometric finish
2. Energy dissipation in the ultra-precision machining of copper
3. Bluntness of the tool and process forces in high-precision machining
4. Tool edge roundness and stable build-up formation in finish machining
5. High precision manufacturing in an advanced industrial economy
6. Ductile regime model for diamond turning of brittle materials
7. Grinding of hard and brittle materials
8. Technological advances in fine abrasive processes
9. Ultra-precision cutting for ZKN7 glass