Improvement of epoxy adhesion to polyimide passivation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1390-1395

  Luo, Shijian ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Amine; Epoxy; Imidazole; Passivation; Polyimide; Surface modification

Indexed keywords

ADHESION; CURING; DERIVATIVES; EPOXY RESINS; HYDROLYSIS; PASSIVATION; POLYIMIDES; SODIUM COMPOUNDS; SURFACE TREATMENT;

HYDROLYTIC STABILITIES;

ELECTRONICS PACKAGING;

EID: 0036296094     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Surface modification of PMDA-ODA polyimide: Surface structure-adhesion relationship
2. Adhesion improvement of epoxy resin/polyimide joints by amine treatment of polyimide surface
3. Pre-encapsulation cleaning methods and control for microelectronics packaging
4. Adhesion of underfill to different surfaces in flip chip packaging
5. Influence of temperature and humidity on adhesion of underfill for flip chip packaging