Influence of grinding process on semiconductor chip strength

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1617-1621

  Wu, Enboa ^a   Shih, I G ^a   Chen, Y N ^a   Chen, S C ^a   Tsai, C Z ^b   Shao, C A ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b MACRONIX INTERNATIONAL CO LTD   (Taiwan)

^c YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (FORMING); GRINDING (MACHINING); SEMICONDUCTOR MATERIALS; STRENGTH OF MATERIALS; STRESS ANALYSIS; WSI CIRCUITS;

SEMICONDUCTOR CHIPS;

CHIP SCALE PACKAGES;

EID: 0036292862     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008323     Document Type: Article

References (6)

1. Silicon Wafer deformation after backside grinding
2. An investigation into the fracture of silicon die used in flip chip applications