System on chip design methodology applied to system in package architecture

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 254-258

  Goetz, Martin ^a  

^a Alpine Microsystems   (United States)

Author keywords

Core based interfaces; Interconnect; SiP; SoC; System on chip; System in package

Indexed keywords

BANDWIDTH; CAPACITANCE; ELECTRIC WIRING; EMBEDDED SYSTEMS; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; SILICON; SWITCHING;

SYSTEM ON CHIP (SOC) ARCHITECTURE;

CHIP SCALE PACKAGES;

EID: 0036292568     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. As VLSI era ends and SOC taps out, future is in cores
2. SIP versus SOC: Partitioning instead of integrating
3. SoC can result in rewards, but beware the tradeoffs