Development of OE integrated surface mount packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 574-577

  Kishida, Yuji ^a   Kuba, Yutaka ^a   Komeda, Ryuji ^a   Okumichi, Takehiro ^a   Setoguchi, Katsuhide ^a   Matsubara, Takahiro ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; DEGRADATION; ELECTRIC DISTORTION; ELECTRIC IMPEDANCE; ELECTRIC LINES; ELECTROMAGNETIC FIELD EFFECTS; ELECTRONICS PACKAGING; FIBER OPTIC NETWORKS; INTERNET; MODULATION; OPTOELECTRONIC DEVICES; SEMICONDUCTOR LASERS; TRANSMITTERS;

OPTOELECTRONICS PACKAGING;

SURFACE MOUNT TECHNOLOGY;

EID: 0036290694     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Surface mountable package (OptoBGA™) for 10G data link
2. Packaging technology of OptoBGA™ for 2.5Gbps
3. Snap array CSP™ - Ceramic CSPs for high performance and high reliability applications