Micromachined barbed spikes for mechanical chip attachment

Sensors and Actuators, A: Physical

Volumn 95, Issue 2-3, 2002, Pages 94-99

  Griss, Patrick ^a   Enoksson, Peter ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Biopotential electrode; Deep reactive ion etching (DRIE); Microneedles; Surface attachment

Indexed keywords

ADHESION; ALUMINUM FOIL; BIOELECTRIC POTENTIALS; ELECTRODES; MICROMACHINING; POLYETHYLENES; REACTIVE ION ETCHING; SILICON; SKIN; SURFACE TREATMENT;

ADHESION FORCE; BARBED SPIKES; BIOPOTENTIAL ELECTRODE; DEEP REACTIVE ION ETCHING; DETACHMENT FORCE; MECHANICAL CHIP ATTACHMENT; POLYETHYLENE FOIL;

BIOSENSORS;

EID: 0036141555     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00719-1     Document Type: Article

References (8)

1. Spiked biopotential electrodes
2. Reed, mating and piercing micromechanical structures for surface bonding applications
3. A mechanical surface adhesive using micromachined silicon structures
4. Design and modelling of a micromechanical surface bonding system
5. Barbed spike arrays for mechanical chip attachment
6. SCREAM I: A single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures
7. Silicon as a mechanical material