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Volumn 23, Issue 3, 2002, Pages 639-644

Effect of copper on the localized corrosion resistance of Ni-Ti shape memory alloy

Author keywords

Localized corrosion tests; Martensitic transformation; Ni Ti Cu alloy; Passive film

Indexed keywords

CORROSION RESISTANCE; ELECTROCHEMICAL CORROSION; NICKEL ALLOYS; SODIUM CHLORIDE; TERNARY SYSTEMS;

EID: 0036132145     PISSN: 01429612     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0142-9612(01)00142-9     Document Type: Article
Times cited : (74)

References (23)
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  • 15
    • 0034038826 scopus 로고    scopus 로고
    • Evaluation by electrochemical tests of the passive film stability of equiatomic Ni-Ti alloy also in presence of stress-induced martensite
    • (2000) J Biomed Mater Res , vol.51 , pp. 47-54
    • Rondelli, G.1    Vicentini, B.2
  • 16
    • 0013504721 scopus 로고
    • ASTM G 5-94 Standard reference test method for making potentiostatic and potentiodynamic anodic polarization measurements
    • vol. 03.02. Philadelphia, PA, USA: American Society for Testing and Materials
    • (1995) Annual book of ASTM standards , pp. 48-58
  • 18
    • 0001369723 scopus 로고
    • Determination of critical pitting potentials of stainless steels in aqueous chloride environments
    • (1971) Electrochim Acta , vol.16 , pp. 1987-2003
    • Pessal, N.1    Liu, C.2
  • 19
    • 0006807414 scopus 로고    scopus 로고
    • ASTM F 746-87 Standard Test method for pitting or crevice corrosion of metallic surgical implant materials
    • vol. 13.01. Philadelphia, PA, USA: American Society for Testing and Materials
    • (1996) Annual book of ASTM standards , pp. 80-85


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.