Reliability, thermal analysis and optimization wirability design of multi-layer PCB boards

Proceedings of the Annual Reliability and Maintainability Symposium

Volumn , Issue , 2002, Pages 392-398

  Tian, Xijin ^a   Palusinski, Olgierd A ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

Optimization; PWB; Thermal analysis; Wirability

Indexed keywords

COSTS; ELECTRONICS PACKAGING; OPTIMIZATION; PRINTED CIRCUIT DESIGN;

PRINTED WIRE BOARD; WIRABILITY DESIGN;

RELIABILITY;

EID: 0036130342     PISSN: 0149144X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Multicriteria decision making in design of printer wire board