Micromachined e-jet for IC chip cooling

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn , Issue , 2002, Pages 356-357+347

  A, Tsung Kuan ^a   Chou, ^a   Najafi, Khalil ^a   Muller, Michael O ^a   Bernal, Luis P ^a   Washabaugh, Peter D ^a   Parviz, Babak A ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEAT SINKS; INTEGRATED CIRCUIT LAYOUT; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; NATURAL FREQUENCIES; THRESHOLD VOLTAGE;

CHIP COOLING;

MICROPROCESSOR CHIPS;

EID: 0036117930     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Microprocessors for the new millennium: Challenges, opportunities, and new frontiers
2. High-density micromachined acoustic ejector array for micro-propulsion