Modeling complex packing structures and their thermal properties

Advanced Powder Technology

Volumn 13, Issue 1, 2002, Pages 55-71

  Jia, X ^a   Gopinathan, N ^a   Williams, R A ^a  

^a UNIVERSITY OF LEEDS   (United Kingdom)

Author keywords

Arbitrary shape; Ceramic processing; Digitization; Particle packing; Thermal conductivity

Indexed keywords

CERAMIC MATERIALS; FINITE ELEMENT METHOD; HEAT TRANSFER; ITERATIVE METHODS; MICROSTRUCTURE; THERMAL CONDUCTIVITY;

CERAMIC PROCESSING; PARTICLE PACKING;

HIGH ENERGY PHYSICS;

EID: 0036103138     PISSN: 09218831     EISSN: None     Source Type: Journal    
DOI: 10.1163/15685520252900956     Document Type: Article

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