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Volumn 16, Issue 1, 2002, Pages 17-21

Novel groove-shaped screen-wick miniature heat pipe

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; EVAPORATORS; HEAT FLUX; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; THERMAL CONDUCTIVITY;

EID: 0036095465     PISSN: 08878722     EISSN: 15336808     Source Type: Journal    
DOI: 10.2514/2.6668     Document Type: Article
Times cited : (29)

References (8)
  • 2
    • 0006091364 scopus 로고    scopus 로고
    • Advances and challenges in micro/miniature heat pipes
    • Keynote Lecture and Invited Lecture: Session K-1, Preprint Japan Association for Heat Pipes and Seikei Univ., Tokyo
    • (1999) 11th International Heat Pipe Conference , vol.3 , pp. 1-18
    • Faghri, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.