Monitoring the change of viscosity during cure reaction of epoxy resins with resin position sensor

Journal of Reinforced Plastics and Composites

Volumn 21, Issue 2, 2002, Pages 139-152

  Kim, Jung Gon ^a   Shin, Kyoung Hoon ^a   Ryu, Ho Seok ^a   Lee, Jae Wook ^a  

^a Sogang University   (South Korea)

Author keywords

Degree of cure; Epoxy resin; Resin position sensor; Resistance; Viscosity

Indexed keywords

CURING; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; POLYAMIDES; RHEOLOGY; RHEOMETERS; SENSORS; VISCOSITY;

DC CONDUCTOMETRY; DEGREE OF CURE; DIGLYCIDYL ETHER OF BISPHENOL-A; GEL POINT; RESIN POSITION SENSOR;

EPOXY RESINS;

EID: 0036090736     PISSN: 07316844     EISSN: None     Source Type: Journal    
DOI: 10.1177/0731684402021002353     Document Type: Article

References (8)