|
|
Volumn 9, Issue 3, 2002, Pages 235-245
|
|
Evaluation of adhesion between glass/epoxy composite substrate and copper foil for printed circuit board applications
a a a |
|
Author keywords
Adhesion; Copper foil; Peel strength; Printed circuit board; Substrate
|
|
Indexed keywords
ADHESION;
COPPER;
CORRELATION METHODS;
ELASTICITY;
EPOXY RESINS;
FRACTURE MECHANICS;
INTERFACES (MATERIALS);
MATHEMATICAL MODELS;
METAL FOIL;
PEELING;
PRINTED CIRCUIT BOARDS;
SCANNING ELECTRON MICROSCOPY;
SURFACE ROUGHNESS;
ADHESIVE STRENGTH;
COMPOSITE MATERIALS;
|
|
EID: 0036090339
PISSN: 09276440
EISSN: None
Source Type: Journal
DOI: 10.1163/156855402320257320 Document Type: Article |
|
Times cited : (5)
|
|
References (8)
|
