HandMon-ISPM: Handling monitoring in a loading station of a furnace

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2002, Pages 113-118

  Trunk, Ralph ^a   Schmid, Heinz ^a   Schneider, Claus ^a   Pfitzner, Lothar ^a   Ryssel, Heiner ^a,b   Bernhardt, Henry ^c   Marx, Eckhard ^c  

^a FRAUNHOFER INSTITUTE FOR INTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB   (Germany)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^c INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

AEC APC; Handling monitoring; Handling system; Loading station; Minienvironment; SPM

Indexed keywords

CORRELATION METHODS; IN SITU PROCESSING; MATERIALS HANDLING; PROCESS CONTROL; PRODUCTION CONTROL; SILICON WAFERS;

ADVANCED PROCESS CONTROL; HANDLING MONITORING SYSTEM; IN SITU PARTICLE MONITORING; SEMICONDUCTOR PROCESS FURNACE; WAFER EDGES; WAFER SURFACES;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036076320     PISSN: 1523553X     EISSN: None     Source Type: Journal    
DOI: 10.1109/ASMC.2002.1001585     Document Type: Article

References (2)

1. Virtual network computing