Analysis of microstrip structures of finite ground plane using the hybrid volume-surface integral equation approach

IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)

Volumn 4, Issue , 2002, Pages 162-165

  Lu, Cai Cheng ^a   Yu, Chun ^a  

^a UNIVERSITY OF KENTUCKY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; ANTENNA GROUNDS; CALCULATIONS; COMPUTATIONAL COMPLEXITY; COMPUTER SIMULATION; ELECTROMAGNETIC WAVE SCATTERING; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; GREEN'S FUNCTION; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; TIME DOMAIN ANALYSIS;

EQUIVALENT CURRENT; FINITE GROUND PLANE; HYBRID VOLUME SURFACE INTEGRAL EQUATION; MICROSTRIP STRUCTURES; MULTILEVEL FAST MULTIPOLE ALGORITHM;

MICROSTRIP ANTENNAS;

EID: 0036076270     PISSN: 15223965     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Time-domain finite difference approach to the calculation of the frequency-dependent characteristics of microstrip discontinuities
2. Application of the three-dimensional finite-difference time-domain method to the analysis of planar microstrip circuits
3. Hybrid full-wave analysis of via-hole grounds using finite-difference and finite-element time-domain methods
4. Characterization of high frequency interconnects using finite difference time domain and finite element methods
5. Electromagnetic scattering and radiation by surfaces of arbitrary shape in layered media, Part I: The theory
6. Efficient MPIE approach for the analysis of three-dimensional microstrip structures in layered media
7. Space domain approach for the analysis of printed circuits
8. Electromagnetic scattering from material coated PEC objects: A hybrid volume and surface integral equation approach
9. A coupled surface-volume integral equation approach for the calculation of electromagnetic scattering from composite metallic and material targets
10. Theory and experiment on microstrip antenna