A general framework for SPICE-TLM interconnection

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2002, Pages 1123-1126

  So, Poman P M ^a   Hoefer, Wolfgang J R ^a  

^a UNIVERSITY OF VICTORIA   (Canada)

Author keywords

Active devices; Distributed device embedding; Hybrid TLM SPICE connection; Lumped device embedding; Nonlinear devices; Time domain modeling; TLM method

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; MICROWAVES;

DISTRIBUTED DEVICE EMBEDDING; HIGH SPEED DIGITAL CIRCUIT MODELING; HYBRID GLOBAL MICROWAVE; LUMPED DEVICE EMBEDDING;

TIME DOMAIN ANALYSIS;

EID: 0036066105     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. A symmetrical condensed node for the TLM method
2. Lumped and distributed device embedding techniques in time domain TLM field models
3. Modeling of nonlinear active regions in TLM
4. Lumped element equivalent circuit parameter extraction of distributed microwave circuits via TLM simulation
5. Modeling of nonlinear active and passive devices in three dimensional TLM networks