Propagation layers for intra-chip wireless interconnection compatible with packaging and heat removal

IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Volumn , Issue , 2002, Pages 36-37

  Guo, Xiaoling ^a   Caserta, James ^a   Li, Ran ^a   Floyd, Brian ^a   O, Kenneth K ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; ANTENNAS; DIELECTRIC MATERIALS; ELECTRIC POWER TRANSMISSION; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; THERMAL CONDUCTIVITY; WIRELESS TELECOMMUNICATION SYSTEMS;

HEAT REMOVAL;

CMOS INTEGRATED CIRCUITS;

EID: 0036057339     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Inter and intra-chip Wireless Clock Signal Distribution Using Microwaves: A Status of an Initial Feasibility Study
2. Characteristics of integrated dipole antennas on bulk, SOI, and SOS substrates for wireless communication
3. On-chip wireless interconnection with integrated antennas
4. A plane wave model approach to understanding propagation in an intra-chip communication system
5. A 15-GHz wireless interconnect implemented in a 0. 18-um CMOS technology using integrated transmitters, receivers, and antennas