Combined level-to-level and within-level overlay control

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4689 I, Issue , 2002, Pages 248-260

  Ausschnitt, Christopher P ^a   Morillo, Jaime D ^a   Yerdon, Roger J ^a  

^a IBM   (United States)

Author keywords

Alignment; Lithography; Overlay; Process control

Indexed keywords

MASKS; MATHEMATICAL MODELS; PROCESS CONTROL; THIN FILM DEVICES;

FIELD-STITCHING CONTROL;

LITHOGRAPHY;

EID: 0036031219     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.473463     Document Type: Article

References (7)

1. G. Gallatin, "Alignment and Overlay," in Microlithography Science and Technology (J.R. Sheats, B.W.Smith, ed.) Marcel Dekker, New York 1998, pp. 317-366.
2. C.P. Ausschnitt, T.J.Wiltshire, "Overlay Control System," US Patent Number 5,877,861 (1999).
3. D. Cronin, G. Gallatin, "Micrascan II Overlay Error Analysis," SPIE, 2196 (1994).
4. H.J. Levinson, W.H. Arnold, "Optical Lithography," in Handbook of Microlithography, Micromachining, and Microfabrication, Vol. 1: Microlithography (P. Rai-Choudhury, ed.) SPIE Press, Washington 1997, pp. 11-138.
5. J.D. Armitage, J.P. Kirk, "Analysis of Overlay Distortion Patterns," SPIE Vol. 921, pp. 207-222 (1988).
6. M.A. van den Brink, et al., "Overlay and Field by Field Leveling in Wafer Steppers Using an Advanced Metrology System," SPIE Vol. 1673, pp. 330-344 (1992).
7. C.P. Ausschnitt, W. Muth, patent filed (2001).