248 nm photolithography compatibility on low-k dielectrics in BEOL interconnects

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4692, Issue , 2002, Pages 547-554

  Hong, Hyesook ^a   Xing, Guoqiang ^a   McKerrow, Andrew ^a   Kim, Tae S ^a   Smith, Patricia B ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

Dual damascene; DUV photoresist; Low k dielectric OSG films; Photoresist poisoning

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; DIELECTRIC FILMS; MASS SPECTROMETRY; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERCONNECTS;

PHOTORESISTS;

EID: 0036030648     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.475693     Document Type: Conference Paper

References (1)

1. S. Lin, C. Jin, L. Lui, M. Tsai, M. Daniels, A. Gonzalez, et al., "Low-k Dielectrics Characterization for Damascene Integration", IEEE 2001