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Volumn 4698, Issue , 2002, Pages 293-303
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Fabrication of adhesiveless lightweight flexible circuits using Langley Research Center soluble-imide "LaRC-SI" polyimide film
a a a a |
Author keywords
Adhesiveless; Compliant substrate; Flexible circuits; Multifunctional structures
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Indexed keywords
ADHESIVES;
MULTILAYERS;
OPTIMIZATION;
PLASTIC FILMS;
POLYIMIDES;
PRINTED CIRCUIT MANUFACTURE;
THERMAL EXPANSION;
LIGHTWEIGHT FLEXIBLE CIRCUITS;
PRINTED CIRCUIT BOARDS;
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EID: 0036028488
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.475076 Document Type: Conference Paper |
Times cited : (2)
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References (21)
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