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Volumn 4698, Issue , 2002, Pages 293-303

Fabrication of adhesiveless lightweight flexible circuits using Langley Research Center soluble-imide "LaRC-SI" polyimide film

Author keywords

Adhesiveless; Compliant substrate; Flexible circuits; Multifunctional structures

Indexed keywords

ADHESIVES; MULTILAYERS; OPTIMIZATION; PLASTIC FILMS; POLYIMIDES; PRINTED CIRCUIT MANUFACTURE; THERMAL EXPANSION;

EID: 0036028488     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.475076     Document Type: Conference Paper
Times cited : (2)

References (21)
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  • 5
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    • K. Gilleo, Handbook of Flexible Circuits, ed. K. Gilleo, (New York: Van Nostrand Reinhold, 1992), pp. 11-13.
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    • Gilleo, K.1
  • 11
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    • Meschter, R.1
  • 12
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    • J. Sallo, "Adhesiveless Flex Substrates: The whys anal how," Printed Circuit Fabrication, Vol. 17, (1994), pp. 83-86.
    • (1994) Printed Circuit Fabrication , vol.17 , pp. 83-86
    • Sallo, J.1
  • 13
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    • J. Munson, Handbook of Flexible Circuits, ed. K. Gilleo, (New York: Van Nostrand Reinhold 1992), p. 33.
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  • 15
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  • 20
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    • Fabricating adhesiveless polyimide multilayer flex circuits
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  • 21
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.