Phosphorus based epoxy terminated structural adhesive 2. Curing, adhesive strength and thermal stability

European Polymer Journal

Volumn 38, Issue 1, 2002, Pages 195-201

  Bhuniya, Sankar Prasad ^a   Maiti, Sukumar ^b  

^a INDIAN INSTITUTE OF TECHNOLOGY   (India)

^b Subarnarekha   (India)

Author keywords

Adhesive strength; Curing; Epoxy resin; Phosphorus containing epoxy resin; Thermal stability

Indexed keywords

CURING; EPOXY RESINS; ETHERS; INTERFACES (MATERIALS); PEELING; PHOSPHORUS; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

ADHESIVE STRENGTH;

ADHESIVES;

EID: 0036027932     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0014-3057(01)00163-X     Document Type: Article

References (14)