Electrical properties of sputtered Ni-Cr-Al-Cu thin film resistors with Ni and Cr contents

Journal of the Korean Physical Society

Volumn 40, Issue 2, 2002, Pages 339-343

  Lee, Boong Joo ^a   Lee, Duck Chool ^a   Kim, Chul Soo ^b  

^a Inha University   (South Korea)

^b Sentrotek Co Ltd   (South Korea)

Author keywords

Annealing; TCR(temperature coefficient of resistance); Thin film resister

Indexed keywords

EID: 0036002811     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

1. N.G. Dhere and D.G/Vaoide, Thin Solid Films 59, 33 (1979).
2. A.P. Bhatt, C.A. Luck and D.M. Stevenson, in Proc. of the 1984 International symp. on microelectronics (1984), p. 370.
3. K. Matsuda, K. Sato, T. Doi, K. Ogata and K. Konishi, National Tech. Rep. 26, (1980), p. 283.
4. W.E. Isler and L.A. Kitchman, IEEE Trans. on Parts, Materials & Packaging PMP-5(3), 139 (1969).
5. E. Schippel, Kristall und Technik 15, 917 (1980).
6. M.A. Bayne, J. Vac. Sci. Technol. A 4, 3142 (1986).
7. J.H. Mooij and M. dejong, J. Vac. Sci. Technol. 9, 446 (1972).
8. A. Belu-Marian, Thin Solid Films 139, 15 (1986).
9. M.I. Birjega, C.A. Constantin, I. TH. Florescu and C. Sarbu, Thin Solid Films 92, 315 (1982).
10. D.M. Buczek, J. Vac. Sci. Technol. 15, 370 (1978).
11. M. Kotai et al., Vacuum, 33(1/2), 49 (1983).
12. W. Pitschke and W. Bruckner, Fresenius J. Anal. Chem. 361, 608 (1998).
13. E. Schippel, Kristall und Technik 15, 917 (1980).
14. Ronald A. Thiel, IEEE transactions on components CAHMT-2, 4 (1979).
15. Takashi Noguchi, J. Korean Phys. Soc. 36, L1 (2000).
16. Joo Yull Rhee, Y.V. Kudryavtsev, Y.P. Lee and K.W. Kim, J. Korean Phys. Soc. 36, 404 (2000).
17. B.J. Lee, Y.P. Lee, J.I. Jeong and Y.M. Koo, J. Korean Phys. Soc. 36, 54 (2000).