Solidification behaviour of Sn droplets embedded in an icosahedral Al-Cu-Fe matrix

Materials Science and Engineering: A

Volumn 304-306, Issue 1-2, 2001, Pages 225-230

  Park, J C ^a   Kim, W T ^b   Kim, D H ^a   Kim, J R ^c  

^a Yonsei University   (South Korea)

^b Chongju University   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Al Cu Fe; Heterogeneous nucleation; Quasicrystal; Sn

Indexed keywords

CONTACT ANGLE; COOLING; CRYSTAL ORIENTATION; DIFFERENTIAL SCANNING CALORIMETRY; DROP FORMATION; HEAT TREATMENT; MELT SPINNING; METAL MELTING; QUASICRYSTALS; SOLIDIFICATION; THERMAL EFFECTS; TIN; TRANSMISSION ELECTRON MICROSCOPY; X RAY CRYSTALLOGRAPHY;

ICOSAHEDRAL QUASICRYSTALS;

ALUMINUM ALLOYS;

MICROSTRUCTURE; PHYSICAL PROPERTY;

EID: 0035978846     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01493-3     Document Type: Article

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