Calibration of straight total reflection X-ray fluorescence spectrometry - Results of a European Round Robin test

Spectrochimica Acta - Part B Atomic Spectroscopy

Volumn 56, Issue 11, 2001, Pages 2283-2292

  Rink, I ^a   Rostam Khani, P ^a   Knoth, J ^b   Schwenke, H ^b   de Gendt, S ^c   Wortelboer, R ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

^b INSTITUTE OF MATERIALS RESEARCH   (Germany)

^c IMEC   (Belgium)

Author keywords

Calibration; Iso angle; Round Robin; TXRF

Indexed keywords

ROUND ROBIN TESTS;

BACKSCATTERING; CALIBRATION; CONTAMINATION; FLUORESCENCE; LIGHT REFLECTION; SILICON WAFERS; SPIN COATING; SYNCHROTRON RADIATION; X RAY ANALYSIS;

SPECTROMETRY;

EID: 0035976299     PISSN: 05848547     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0584-8547(01)00297-X     Document Type: Article

References (13)

1. Test method for measuring surface metal contamination on silicon wafers by total reflection X-ray fluorescence spectrometry
2. Calibration accuracy of different Atomika TXRF 8010 instruments
3. Discrimination between particulate and film type contamination on surfaces by means of total reflection X-ray fluorescence spectrometry
4. Total reflection X-ray fluorescence analysis
5. Study of transition metal contamination caused by SC-1 treatment using TXRF
6. Calibration of total-reflection X-ray fluorescence using a nickel bulk sample
7. Depth profiling in surfaces using total reflection X-ray fluorescence