A TEM study of the microstructure of SiCp/Al composite prepared by pressureless infiltration method

Scripta Materialia

Volumn 45, Issue 10, 2001, Pages 1183-1189

  Luo, Z P ^a,b   Song, Y G ^a   Zhang, S Q ^a  

^a BEIJING INSTITUTE OF AERONAUTICAL MATERIALS   (China)

^b TEXAS A AND M UNIVERSITY   (United States)

Author keywords

Aluminum; Composites; Microstructure; Transmission electron microscopy

Indexed keywords

ALUMINUM; EUTECTICS; INTERFACES (MATERIALS); MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; SILICON CARBIDE; THERMOANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

PHASE FORMATIONS;

METALLIC MATRIX COMPOSITES;

EID: 0035914590     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(01)01148-4     Document Type: Article

References (15)