Via-free broadband microstrip to CPW transition

Electronics Letters

Volumn 37, Issue 15, 2001, Pages 960-961

  Lin, T H ^a  

^a CHUNGHWA TELECOM CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CAVITY RESONATORS; COMPUTER SIMULATION; ELECTRIC FIELD EFFECTS; MICROSTRIP LINES; MICROWAVE INTEGRATED CIRCUITS; MULTILAYERS;

BROADBAND MICROSTRIPS; ELECTROMAGNETIC COUPLINGS;

WAVEGUIDES;

EID: 0035913072     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20010674     Document Type: Article

References (6)

1. A wideband CPW-to-microstrip transition for millimeter-wave packaging
2. Rigorous analysis of mixed transmission line interconnects using the frequency-domain TLM method
3. A coplanar-to-microstrip transition for W-band circuit fabrication with 100-pm-thick GaAs wafers
4. W-band finite ground coplanar waveguide (FGCPW) to microstrip line transition
5. Microstrip/slotline transitions: Modeling and experimental investigation
6. Reactances of slotline short and open circuits on alumina substrate