Automated vision system for IC lead inspection

International Journal of Production Research

Volumn 39, Issue 15, 2001, Pages 3353-3366

  Hou, Tung Hsu Tony ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; AUTOMATION; COMPUTER VISION; ELECTRONICS PACKAGING; INDUSTRIAL RESEARCH; INSPECTION; PRINTED CIRCUIT MANUFACTURE; SURFACE MOUNT TECHNOLOGY;

AUTOMATED VISION SYSTEM; DUAL IN-LINE PACKAGE; IMAGE ACQUISITION SYSTEM; LEAD INSPECTION SYSTEM; SMALL OUTLINE PACKAGE;

INTEGRATED CIRCUIT TESTING;

EID: 0035889174     PISSN: 00207543     EISSN: None     Source Type: Journal    
DOI: 10.1080/00207540110061913     Document Type: Article

References (5)

1. Collins, R., 1992, Projective reconstruction of approximately planar scenes, 21st AIPR Workshop, SPIE Proc. 1839, pp. 174-185.
2. Fukuchi, K., 1994, IC shape measurement devices, Journal of Electronics Material, May, pp. 91-94. (in Japanese)
3. Gonzalez, R. C. and Woods, R. E., 1992, Digital Image Processing (Addison-Wesley).
4. Smeyers, G. and Truyens, C., 1992, A lead coplanarity inspection system for surface mounted devices. Electronic Manufacturing Technology Symposium (IEEE/ISHM'92), pp. 270-277.
5. Stanke, G., Wohrle, T., and Schilling, F., 1998, High-precision and versatile optical measurement of different sides of IC's in the confectioning process using only one viewpoint, Proceedings of the 24th Annual Conference of the IEEE, Vol. 4, pp. 2425-2427